Wire Bond 工艺工程师/Wire Bond Process Engineer
德州仪器半导体制造有限公司ChengduUpdate time: August 17,2019
Job Description
成都市

Wire Bond Process Engineer

Job Descriptions:

  • Being responsible for developing gold and copper wire bond process capability, and building process windows to support volume productions, including collaborate with Equipment, Manufacturing and QRA on troubleshooting and problem solving

  • Being responsible for wire bond total performance improvement programs, including but not limited to quality, tool stability, PPH, cost and operation efficiency

  • Work with Packaging R&D teams in Headquarter and Chengdu on new product development, and the transitions from engineering mode to volume productions

  • Work with worldwide Assembly/Test Factories on worldwide projects and best practice sharing


Minimum Requirements:

  • Bachelor degree or above with major in material, mechanical, or electrical engineering

  • 5 years’ or above experience in Gold or Copper wire bond engineering. Experiences in wire bond equipment will be a plus

  • Fluent communication in both Mandarin and English, presentation skill and technical report writing

  • Being able to work under pressure and in international company environment

  • Always positive to collaborate, solve problems and commit to success and excellence



职能类别:工艺工程师

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上班地址:高新西区科新路8号附10号

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