Wire Bond Process Engineer
Job Descriptions:
Being responsible for developing gold and copper wire bond process capability, and building process windows to support volume productions, including collaborate with Equipment, Manufacturing and QRA on troubleshooting and problem solving
Being responsible for wire bond total performance improvement programs, including but not limited to quality, tool stability, PPH, cost and operation efficiency
Work with Packaging R&D teams in Headquarter and Chengdu on new product development, and the transitions from engineering mode to volume productions
Work with worldwide Assembly/Test Factories on worldwide projects and best practice sharing
Minimum Requirements:
Bachelor degree or above with major in material, mechanical, or electrical engineering
5 years’ or above experience in Gold or Copper wire bond engineering. Experiences in wire bond equipment will be a plus
Fluent communication in both Mandarin and English, presentation skill and technical report writing
Being able to work under pressure and in international company environment
Always positive to collaborate, solve problems and commit to success and excellence
职能类别:工艺工程师
联系方式
上班地址:高新西区科新路8号附10号
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