1. Power IC product development

2. CIS product development

3. NVM (MRAM, RRAM) product development

4. MEMS product development

5. 3D-IC development

6. Analog/RF product development

1. MS degree or above in Engineering or Science related (EE, Physics, Material Sciences, ...)

2. Familiar with process/device/product analysis in related fields is preferred.

3. At least 3-yr experiences of related fields.

4. Good communication skills, can converse in both Chinese & English.