1.Manage and improve Si / Bumping / Package process

2.Plan and execute defined improvement actions with module

3.Yield improvement and reliability qualify

1.Master degree and above. Major in Material / Electrical / Chemical related fields

2.Over 5-year experience in BEOL / Bump / PKG related fields

3.With good problem solving skills

4.Exhibit good communication skills for cross-functional team-work

5.Fluent in English