Principle Packaging Engineer
Western DigitalShanghaiUpdate time: May 27,2021
Job Description

公司介绍

The future. It’s on you. You & Western Digital.


We’ve been storing the world’s data for more than 50 years. Once, it was the most important thing we could do for data. Now we’re helping the world capture, preserve, access and transform data in a way only we can.

The most game-changing companies, consumers, professionals, and governments come to us for the technologies and solutions they need to capture, preserve, access, and transform their data.

But we can’t do it alone. Today’s exceptional data challenges require your exceptional skills. It’s You & Us. Together, we’re the next big thing in data. 
 
Western Digital® data-centric solutions are found under the G-Technology™, HGST, SanDisk®, Tegile™, Upthere™, and WD® brands.

职位描述

1. Lead new package development project.

2. Process characterization and qualification

3. Product prototype and qualification.

职位要求

REQUIRED:

  • More than 3 years of related design experience.
  • Familiar with Cadence, Schematic, Gerber, CAD and other design software.

PREFERRED:

  • Prefer to have experience at BGA and PCBA product design.
  • Stencil design experience 

SKILLS:

  • Strong communication skills
  • Good in English at speaking and writing

额外信息

  • Substrate and PCB design.
  • Design optimization.
  • Product Stack up and Bonding design.
  • PCBA layout design
  • Product outline design

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