Responsibilities:

• Responsible for the development, implementation, ramp up, and continuous improvement of various advanced dicing technology used to manufacture discrete package
• It involves process development, new design and technology setup, commissioning strip to strip singulation
• This role requires in-depth understanding of both process physics and material to understand its process robustness and package integrity
• Able to study the material interaction with process
• To understand the process integration risk and come out with a risk mitigation plan
• A structural way for reporting and data analysis

Job Requirements:

• Must have a Master/Degree in Mechanical Engineering/ Electrochemical/ Applied Physics or related discipline with minimum 5 years’ experience in the singulation field as a process manufacturing or development engineer in a semiconductor or other relevant
• Solid knowledge in Mechanical, Singulation stress for singulation process
• Solid leadership of cross-functional projects will be required to successfully solve complex unit process and/or integration challenges
• Willingness to take responsibility and ownership to aggressively focus on problems either individually or part of a larger team
• Flexibility in absorbing into other field of knowledge
• Excellent verbal and written communication skills
• Capability to adapt to the company’s changing needs and priorities and be a self-motivated team player
• A disciplined use of statistical methods (Minitab, DOE, Technical report writing, FMEA & etc) is required

上班地址：黄江镇田美工业园北区A安世半导体（中国）有限公司