Responsibilities:

• Responsible for the development, implementation, ramp up, and continuous improvement of various advanced electrochemical and chemical processes used to manufacture discrete package
• It involves process development, new design and technology setup, commissioning strip to strip and reel to reel new plating lines
• It requires in-depth understanding of both process physics and chemistry to achieve the process robustness
• Able to study the material interaction with process
• To understand the process integration risk and come out with a risk mitigation plan.
  

Job Requirements:

• Must have a Master/Degree in Chemical Engineering/ Electrochemical/ Applied Chemistry or related discipline with minimum 5 years’ experience in the plating field as a process manufacturing or development engineer in a semiconductor or other relevant.
• Solid knowledge in Chemistry analysis for plating bath (inorganic and organic compound)
• Solid leadership of cross-functional projects will be required to successfully solve complex unit process and/or integration challenges
• Willingness to take responsibility and ownership to aggressively focus on problems either individually or part of a larger team
• Flexibility in absorbing into other field of knowledge
• Excellent verbal and written communication skills
• Capability to adapt to the company’s changing needs and priorities and be a self-motivated team player
• A disciplined use of statistical methods (Minitab, DOE, Technical report writing, FMEA & etc) is required
• Knowledge of Chemical Deflash process & its implementation are preferable

上班地址：黄江镇田美工业园北区A安世半导体（中国）有限公司