Responsibilities:

• Responsible for the development, implementation, ramp up, and continuous improvement of various advanced Epoxy Mold Compound used to manufacture discrete package
• Establish a good process characterization
• Able to study the material interaction with process
• To understand the process integration risk and come out with a risk mitigation plan
• A structural way to deliver data and report

Job Requirements:

• Must possess a Master/Degree in Chemical Engineering/ Electrochemical/ Applied Chemistry or related discipline with minimum 5 years’ experience in the molding encapsulation field as a process manufacturing or development engineer in a semiconductor or other relevant industry
• Solid knowledge in process characterization and epoxy mold compound properties characterization
• Solid leadership of cross-functional projects will be required to successfully solve complex unit process and/or integration challenges
• Willingness to take responsibility and ownership to aggressively focus on problems either individually or part of a larger team
• Excellent verbal and written communication skills
• Capability to adapt to the company’s changing needs and priorities and be a self-motivated team player
• A disciplined use of statistical methods (Minitab, DOE, Technical report writing, FMEA & etc) is required

上班地址：黄江镇田美工业园北区A安世半导体（中国）有限公司