?Failure Analysis Engineer will be responsible for analyzing the problem IC to find the root cause of failure, such as customer application problem, wafer manufacture defect, assembly package issue, etc.

?A Failure Analysis (FA) Engineer must be able to interpret test data, conduct bench-level testing verification of the failure mode and perform various product analysis processes to determine the failure mechanism of the reported problem. An in-depth understanding Analog and digital circuits are required. The devices analyzed include new designs/products, low yield on existing products, qualification failures, and returns from customers.

?The successful candidate will reproduce electrical failures in a lab environment and locate/characterize defect or anomaly using a variety of electrical, optical, and physical techniques.

?Collaboration is expected with experts within the FA lab and other organizations, e.g., Design, Test, and Manufacturing.

?FA results will be documented in formal failure analysis reports. Analysis techniques will involve a range of approaches including: rigorous analysis of the device on evaluation boards (EVBs), detailed in-circuit probing to examine signal behavior deprocessing of the packaged device in order to identify the cause of failure.

?In addition many advanced tools such as Focused Ion Beam (FIB), Scanning Electron Microscopy (SEM), EMMI and Laser Induced Electrical Stimulation tools (e.g. OBIRCH) are used in the investigation, isolation and identification of problems.

?Degree in Electrical Engineering Science.

?Demonstrated data analysis and problem solving skills.

?Ability to resolve complex customer issues and lead cross-functional teams.

?Strong English written and verbal communication and presentation skills and ability to influence others.

?Process control and other six sigma tools knowledge.

?Flexibility to adjust to change and multiple ongoing issues in a fast-paced, customer-focused environment.

?Ability to work independent of management with leadership skills.