Responsibility：

The main part of the job includes

(a) create high quality compact models for semiconductor devices to allow circuit simulations on SPICE simulators, such as spectre and ADS;

(b) device characterization;

(c) support technology transfer between fabs. The devices include but are not limited to MOS, LDMOS, BJT, ESD, etc. The compact models are created by multiple steps, such as measurement, parameter extraction, QA, and documentation. The other part of the job is to develop tools for modeling, fab transfer, and design.

The candidate will work closely with senior device, process, and design engineers.

The candidate will also work with foundries when required by tasks.

Requirements：

• PhD or Master in EE or related field.

• A strong background in semiconductor device physics. Having the following are considered big plus: Knowledge and experience on compact models such as BSIM, PSP, HICUM, MEXTRAM; experience with ICCAP; Knowledge on Verilog-a coding; trouble-shooting skill.

• Good computer programming skill. Coding experience and skill with language C, Perl, Python is a plus.

• Knowledge of DC & RF device characterization techniques

• Outstanding communication and interpersonal skills

上班地址：北京市朝阳区建国门外大街乙118号京汇大厦23层