Job Description
Responsibilities include, but are not limited to:
Participating in technology development, transfer, and ramp activities to meet yield, reliability, cost, and device performance goals;
Driving and prioritizing integrated experiments to troubleshoot and optimize process flows;
Owning particular sections of process flow, and responsible for its optimization, cost reduction, and performance improvement goals;
Maintaining and driving process qualification matrix and deliverables;
Rapid response to process excursions and drive to quick integrated solutions;
Working with Process Engineering to improve process stability and capability as well as reduce defects;
Exercising good judgment, sometimes with insufficient data, to determine appropriate action and mitigate integrated risks

Qualifications

Must possess a MS or Ph.D. in Electrical Engineering, Materials Science, Physics, Chemistry or Chemical Engineering. Additional qualifications include:
Minimum 3 years of direct experiences in integration, device, yield analysis or process engineering organizations is required.
Direct experience in 3D NAND technology development, transfer, ramping and sustaining are preferred.
A proven history of technical problem solving through the creation of solutions that demonstrated creativity and out-of-box thinking.
Excellent data extraction and analysis skills, and well versed in DOE principles.
Understanding of device physics in deciphering parametric data, and understanding of fundamental integration and yield issues for key modules and critical device parameters are required
Ability to multi-task and be effective in providing timely solutions.
Strong organizational and communication skills to manage tasks across Process Engineering areas to effectively execute and commit to deliverables

Inside this Business Group

Non-Volatile Solutions Memory Group: The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices. The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.