2019 US Recruitment
台灣積體電路製造TaiwanUpdate time: September 7,2019
Job Description
Hot jobs:
1. 2nm-5nm R&D Engineer (Device, Integration, Module)
2. Pathfinding Research Engineer
3. Chip Design (front-end, back-end)/Physical Design Engineer
4. MtM R&D and Process Technology Engineer
5. Process Engineer, Process Integration Engineer
6. 2020 Summer Internship
7. Salary: NTD37,000 or above
Majority of the above positions are located in Taiwan and China; a few in America.It’s highly recommended to upload your homemade resume together with submission, thank you.
Qualifications
Master or Ph.D degree in Science, Engineering & Business background who can onboard before Dec., 2020
Primary Location: Taiwan
Job: Overseas Recruitment Project
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