Job Title: RF Design/Layout Engineer

Board Solutions is a central team within NXP’s Technology & Operations organization responsible for design, manufacturing, compliance and supply chain operations of PCBs (boards). The organization provides PCB solutions to all business units within NXP through its global presence in US, EU, and Asia. Business units include consumer, industrial, automotive, digital networking, RF, analog, and sensors.

Shanghai Board Solutions team supports the New Production Introduction (NPI), system design, validation & testing, PCB assembly & manufacturing to worldwide NXP Business Units. The Board Solutions RF Design/Layout Engineer position is a role responsible for RF related PCB board design. The design goes from the initial concept to manufacturing, testability, safety and quality of the hardware products. The candidate need strong technical understanding RF related technologies and general electronics(analog/digital/power). The job location is NXP Pudong office, Shanghai.

Job responsibilities:

Be responsible for project implementation focusing RF circuits and system included RF circuit topology drafting and schematic design, component selection (RF IC and front-end circuit) and PCB layout.

RF circuits analysis, simulation, impedance matching and fine tuning, S parameter measurement. Radio chip crystal tuning, loop gain, startup time measurement.

RF circuits prototyping, bring up, tuning and debugging, and problem solving.

Co-work with global BU partner, software and hardware teams on RF platform architecture definition.

Enhance RF competence in Board Solutions global team and guide other designers for RF circuit design support.

Other than RF design, also work on general hardware design.

Communicate with BU (business unit) partner to define Technical Requirements Document (TRD). Define architecture block diagram to implement design per TRD.

Create preliminary parts list (PPL), schematics, layout, and BOM; Submit, archive and release these items through Agile meeting quality and schedule requirements

Work with Marketing, Applications, Product Engineer, Test Engineer, and MPM to create a quality manufacturable product

Participate in peer reviews of schematics and layouts to improve RF products quality across the global Board Solutions team.

Implement designs that are competitive with industry standards, high quality, cost effective, and delivered on time

Key Competencies:

Ability to design RF application board schematic and/or PCB layout.

Ability to understand basic parameter of PCB materials and select RF board PCB material.

Knowledge in RF product compliance test for FCC/CE/ESD.

Ability to design NFC, Wifi/BT, Cellular RF experience preferred.

Ability of RF signal simulation is a plus.

Ability to understand system level design including mechanical, thermal, PCBA, cabling, PSU, firmware, etc.

Ability to understand manufacturing process and quality requirement. Understand DFx (DFM/DFA) process.

Ability to be familiar with all kinds of RF electronics components and their major manufacturing vendors.

Master Cadence tools including OrCAD and Allegro.

Good technical and analytical skill with ability to perform RF board trouble shooting and debug effectively.

Education and Experience:

Bachelor or Master degree in electronics, product & industrial design, or related filed, Master is a preferred.

5+ years experiences in RF hardware board design or equivalent working experience

Experience in embedded systems, NFC, RF and wireless system development will be an extreme advantage.

Good communication, Fluent English in speaking and good documentation capabilities

Have a determined mindset and personal commitment to high quality work with schedule.

Good teamwork adaptability and self-motivated ability.

工作职位: 射频电路设计工程师

NXP硬件系统解决方案team是NXP公司技术运作组织（T&O）的核心部门。主要负责硬件电路板的设计，生产，兼容性测试以及供应链运作。我们向NXP的全球各个Business Units提供PCB电路板解决方案，包括美洲，欧洲，亚洲等等。Business Units 涵盖了消费类，工业，汽车，数字网络，射频，模拟以及传感器等。

上海NXP硬件系统解决方案team面向全球NXP业务支持新产品导入（NPI），系统级硬件设计、验证与测试，PCB装配和生产。硬件系统解决方案团队的射频设计工程师职责主要是负责射频印制电路板的设计。从初始概念到设计为可生产，可测试，安全可靠的硬件产品。应征者需要有很强的射频相关的技术背景和模拟、数字、电源电路方面的基本知识。我们工作地点是上海浦东。

工作职责：

• 负责项目执行中射频相关电路和系统的拓扑设计，原理图设计，元器件选择（射频集成器件和前端电路）以及PCB 布线。
• 射频电路分析，仿真，阻抗匹配和微调，S参数测量。射频芯片晶振微调，环路增益和起始时间测量。
• 射频电路原型板设计，调试，匹配微调和相关问题解决。
• 和全球BU，软件，硬件团队合作，定义射频平台的架构。
• 增强硬件方案团队的射频能力，指导其他设计师射频电路的相关设计
• 其他非射频电路的硬件设计
• 和BU沟通设计需求，并根据技术需求文档提供设计功能方框图
• 创建主要元件列表，原理图，layout以及BOM。根据agile流程，按项目计划，提交并发布相应的设计文档。
• 和市场，应用，产品工程师，测试工程师以及项目生产经理一起合作创造质量可靠的可生产的产品。
• 参与同事的项目原理图，layout 相互检查，确保设计正确性
• 执行设计可竞争性，高质量，低成本以及按时交付。

关键能力：

• 射频电路板的原理图及PCB 设计能力
• 能理解基本的PCB材料的参数并选择射频电路板材料
• 熟知射频产品电磁兼容测试如FCC/CE/ESD.
• 有射频电路（NFC，WIFI/蓝牙，手机）设计经验优先
• 有射频信号仿真能力优先
• 理解系统级设计包括结构，散热，电路板，线缆，电源，软件等等。
• 理解生产流程和质量需求。理解DFM/DFA流程
• 熟悉各种射频电子元件以及主要生产厂家
• 熟练掌握OrCAD 以及 Allegro 工具软件。有layout经验优先。
• 善于分析技术问题，有调试经验，能有效解决电路系统技术问题

教育和经验：

• 本科或硕士学历，电子电路，工控或相关领域。硕士优先。
• 5年以上射频硬件电路设计或在电子产品设计生产领域相关工作经验。
• 有嵌入式系统，NFC，射频和无线系统等相关产品的开发经验者优先
• 很好的沟通和流利的英语口语和书写能力
• 有坚定的心态和对高质量工作的个人承诺
• 有团队合作精神以及自我激励能力

上班地址：亮景路192号 NXP半导体上海分公司